The Simulation of Thermomechanically Induced Stress in Plastic Encapsulated IC Packages, (Paperback)

Name: The Simulation of Thermomechanically Induced Stress in Plastic Encapsulated IC Packages, (Paperback)
Brand: Dr Gerard Kelly
SKU: prod_9b2132b474a1adaaf3f693db
Price: 189.00 USD
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The Simulation of Thermomechanically Induced Stress in Plastic Encapsulated IC Packages, (Paperback) Author: Springer ISBN: 9781461372769 Format: Paperback Publication Date: 2012-10-08 Page Count: 134

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The Simulation of Thermomechanically Induced Stress in Plastic Encapsulated IC Packages, (Paperback)—

$189.00

Price unavailable

The Simulation of Thermomechanically Induced Stress in Plastic Encapsulated IC Packages, (Paperback)—

$189.00