Phenom II X6 1055T / 1055 2.8G 125W Hexa-core CPU HDT55TFBK6DGR Socket AM3

Important notes: 1) This CPU is used — surface scratches can appear and are normal; please do not purchase if this is an issue. 2) Units ship from China or Malaysia at random; origin does not affect functionality. 3) Only the processor is included in this listing — no cooler is provided. Product overview: Fits Phenom II X6 family, model 1055T (also referenced as 1055). OEM/tray part number: HDT55TFBK6DGR. Boxed retail version (includes fan and heatsink): HDT55TFBGRBOX. Stepping codes: ACBBE CB, CCBBE CB. CPU type: Desktop microprocessor. Key clocks and links: Base frequency 2800 MHz; Turbo frequency 3300 MHz (active when 3 cores or fewer are used); bus speed 667 MHz; clock multiplier 14. Memory and interconnect: Integrated memory controller with one 2000 MHz 16-bit HyperTransport link (4 GT/s). Supports DDR2-1066 and DDR3-1333 (2 channels, 72-bit channel width), up to 2 DIMMs per channel, maximum memory bandwidth 21.3 GB/s. Packaging and cooling: 938-pin organic micro-PGA package, Socket AM3. Associated fan/heatsink part: AV-Z7UH40Q001-4909. Platform and chronology: Microarchitecture K10 on the Leo platform. Processor core: Thuban stepping PH-E0, CPUID 100FA0. Introduction date April 27, 2010; launch price $199. Manufacturing and silicon: 0.045 micron silicon-on-insulator (SOI) process; die size 346mm2; 64-bit data width. Compute resources: 6 CPU cores and 6 threads. Floating Point Unit: integrated. Cache configuration: L1 — 6 x 64 KB instruction caches (2-way) and 6 x 64 KB data caches (2-way); L2 — 6 x 512 KB (16-way set associative, exclusive); L3 — shared 6 MB (48-way set associative). Cache latencies: L1 = 3, L2 = 13, L3 = 48. Multiprocessing: intended for uniprocessor systems. Instruction sets and features: MMX and Extended MMX, 3DNow! and extensions, SSE / SSE2 / SSE3 / SSE4a, 64-bit support, EVP (Enhanced Virus Protection), virtualization support, Turbo Technology. Power management and low-power features: Cool'n'Quiet 3.0, C1 and C1E states; package power states S0, S1, S3, S4 and S5. Integrated graphics: None. Other I/O: HyperTransport 3. Electrical and thermal specifications: Operating voltages — 1.15V - 1.475V (at rated frequency); 1.25V - 1.475V (Turbo mode); 1V - 1.225V (minimum state). NorthBridge voltage: 1.05V - 1.175V. Maximum operating temperature: 55°C - 62°C. Thermal Design Power (TDP): 125 Watt.