Intel Xeon X5680 3333 MHz (Turbo 3600 / 3467 MHz) 6-Core 12-Thread 12MB L3 130W LGA1366 CPU

Overview: Server-class Intel Xeon X5680 (Fits Xeon 5600 family) — 6 cores and 12 threads with a base clock of 3333 MHz. Turbo frequencies reach 3600 MHz for 1–2 cores and 3467 MHz for 3 or more cores. Clock multiplier: 25. Bus/QPI: 6.4 GT/s QPI (3200 MHz). Part numbers & S-Specs: OEM/tray part number AT80614005124AA. Boxed part number BX80614X5680. S-spec identifiers include Q3UV and SLBV5. (Specification: ES/QS listings as supplied.) Architecture & manufacturing: Microarchitecture Westmere (Taylorsburg-EP / Taylorsburg-EN / Taylorsburg-WS platforms). Stepping B1 (SLBV5). CPUID values: 206C1 (Q3UV) and 206C2 (SLBV5). Fabricated on a 0.032 micron high-K metal gate process with 1.17 billion transistors and a die area of 240 mm². 64-bit data width. Caches & compute units: 6 CPU cores, 12 threads, with a fused floating point unit. L1: 6 × 32 KB instruction (4-way) and 6 × 32 KB data (8-way). L2: 6 × 256 KB, 8-way set-associative. Shared L3: 12 MB, 16-way set-associative. Memory & I/O: Single integrated memory controller with 3 memory channels. Supports DDR3-800, DDR3-1066, and DDR3-1333. Maximum supported system memory: 288 GB. Maximum memory bandwidth: 32 GB/s. ECC supported. Other I/O: Fast Path Interconnect (2 links). Multiprocessing: up to 2 processors. Features & extensions: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, AES. EM64T (Extended Memory 64 Technology), Hyper-Threading (HT), VT-x, VT-d, Trusted Execution Technology (TXT), Turbo Boost (TBT). Security features include NX/XD (Execute Disable Bit). Low-power support via Enhanced SpeedStep Technology. Package & thermal: Flip Chip Land Grid Array (FC-LGA10) pad for Socket 1366 / B / LGA1366. Physical dimensions: 1.77" × 1.67" (4.5 cm × 4.25 cm). Voltage range: 0.8V – 1.3V. Maximum operating temperature: 78.5°C. Thermal Design Power (TDP): 130 watts.