Intel Xeon E3-1270 / E3 1270 3.4 GHz Quad-Core (Sandy Bridge) LGA1155 8MB 80W

Overview: Compatible with the Xeon E3-1200 family, the E3-1270 is a Sandy Bridge server CPU offering 4 physical cores and 8 threads with a base clock of 3400 MHz and an 8 MB shared L3 cache. Available as OEM/tray (CM8062307262403) and boxed (BX80623E31270) units. Introduction date: Apr 3, 2011. Last order date: December 27, 2013. Last tray shipment date: December 5, 2014. Identification & manufacturing: Model number E3-1270 (fits Xeon E3-1200), platform Bromolow, microarchitecture Sandy Bridge, stepping D2 (Q1HW, SR00N). CPUID 206A7 (SR00N). Manufacturing process: 0.032 micron High-K metal gate process. Data width: 64 bit. Uniprocessor configuration. Clock & bus: Base frequency 3400 MHz. Maximum Turbo Boost frequencies: 3800 MHz (1 core), 3700 MHz (2 cores), 3600 MHz (3 cores), 3500 MHz (4 cores). Bus speed: 5 GT/s. Clock multiplier: 34. Cache: L1 — 4 x 32 KB instruction (8-way) and 4 x 32 KB data (8-way). L2 — 4 x 256 KB (8-way). L3 — 8 MB shared, 16-way set associative. Cores, threads & FP unit: 4 CPU cores, 8 threads, with an integrated Floating Point Unit. Memory & integrated graphics: Single integrated memory controller with 2 channels. Supported memory types: DDR3-1066 and DDR3-1333. Maximum supported memory: 32 GB. Maximum memory bandwidth: 21.3 GB/s. ECC: Yes. Integrated graphics: None. Instruction set & virtualization features: Supports MMX, SSE, SSE2, SSE3, SSSE3, SSE4 (SSE4.1 + SSE4.2), AES instructions, AVX, EM64T, NX/XD. Hyper-Threading: Yes. Virtualization: VT-x and VT-d supported. Trusted Execution Technology (TXT) supported. Turbo Boost Technology 2.0 supported. Low-power states: C1, C1E, C3 and C6 thread/package states. Enhanced Intel SpeedStep Technology supported. I/O & peripherals: Direct Media Interface 2.0 and PCI Express 2.0 interface. Package & mechanical: Package type: 1155-land Flip-Chip Land Grid Array (FCLGA 1155). Socket: 1155 / H2 / LGA1155. Die/package size: 1.48" x 1.48" (3.75 cm x 3.75 cm). Power & thermal: Thermal Design Power (TDP): 80 Watt. Minimum power dissipation: 5.5 Watt (C6 state). Operating temperature range: 5°C - 69.1°C. Part numbers & S-specs: CPU part numbers CM8062307262403 (OEM/tray) and BX80623E31270 (boxed). S-spec and production identifiers include ES/QS processors and production processors Q1HW SR00N BX80623E31270 + CM8062307262403 + +.