ESP32-S3 IR Thermal Imaging Camera Module,Equipped with ESP32-S3-WROOM-1,80x62Pixels IR Array,ExternalDevice Expansion B,1 * ESP32-S3 IR Thermal Imaging Camera Module

This is a wireless IR thermal imaging camera 45°FOV (Field of View) based on the ESP32-S3-WROOM-1 chip, adopts the hybrid technology of microbolometer and thermopile pixel, features 80x62 array pixels. Compact size design, more space-saving, making it ideal for embedded applications. Built in 512KB of and 384KB ROM, with onboard 8MB PSRAM and an external 16MB Flash memory. Type-C connector, enhancing device compatibility and user convenience. It detect the IR distribution of objects in of view, turn the data into the temperature of the objects by calculation, and then generate thermal images. It integrates a recharge and discharge circuit, with onboard Li -um tte-ry header for flexible power supply. Onboard RGB LED indicator for real-time monitoring the operating status of the module. Supports tte-ry Power Supply: Onboard 3.7V MX1.25 Li um tte-ry recharge / discharge header for flexible power supply solution, extending device operation time. Onboard 2 x 10 solder pads, including 14 x GPIO, 1 x , and 1 x UART, for external device expansion. Equipped with ESP32-S3-WROOM-1 Xtensa 32-bit LX7 dual-core processor, up to 240MHz main frequency, offering powerful data processing capabilities. Supports 2.4GHz WiFi (802.11 b/g) and Bluetooth 5 (LE), with onboard antenna.