AMD 100-100000457BOX Bundle — ASRock B550 PHAN GAM 4 AC Motherboard + Cooler Master MGZ-NDSG-N07M-R2 Thermal Paste

Bundle includes AMD 100-100000457BOX with the ASRock B550 PHAN GAM 4 AC motherboard and Cooler Master MGZ-NDSG-N07M-R2 thermal grease. Note: a BIOS update may be required to enable support for AMD Zen 3 Ryzen 5000 series CPUs. AMD B550 Supports AMD Ryzen 5000 Series / 4000 G-Series / 3000 Series Processors. Memory support and overclocking ranges for AMD Ryzen series APUs (Renoir): DDR4 4733(OC)+ / 4666(OC) / 4600(OC) / 4533(OC) / 4466(OC) / 4400(OC) / 4333(OC) / 4266(OC) / 4200(OC) / 4133(OC) / 4000(OC) / 3866(OC) / 3800(OC) / 3733(OC) / 3600(OC) / 3466(OC) / 3200 / 2933 / 2667 / 2400 / 2133 (AMD Ryzen series APUs (Renoir)). Memory support and overclocking ranges for AMD Ryzen series CPUs (Matisse): DDR4 4533(OC)+ / 4466(OC) / 4400(OC) / 4333(OC) / 4266(OC) / 4200(OC) / 4133(OC) / 4000(OC) / 3866(OC) / 3800(OC) / 3733(OC) / 3600(OC) / 3466(OC) / 3200 / 2933 / 2667 / 2400 / 2133 (AMD Ryzen series CPUs (Matisse)). Processor characteristics shown: 7nm Cezanne (Zen 3) 65W 16MB L3 Cache 3MB L2 Cache None Integrated Graphics. Cooler Master thermal paste properties: high-performance formulation using nanoparticles to boost heat transfer from CPU or GPU to your cooler; exceptional thermal conductivity with a K value of 14W/mK; anhygroscopic (non moisture absorbent) and electrically insulated to help protect components from moisture and electrical conduction.