John H Lau 3D IC Integration Hardcover sku-45057007
No rating yet(0 ratings)John H Lau's 3D IC Integration and Packaging is listed under Technology & Engineering Books. The hardcover lists McGraw-Hill Companies as its author, has 480 pages and was published on 2015-08-27. ISBN: 9780071848060. SKU: sku-45057007.
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