18Pieces 3D BGA Reballing Station — Motherboard Middle Layer Tin Planting Platform (Fits 90x90mm Stencils)

18pcs BGA reballing kit for motherboard middle-layer tin placement. The set contains the planting platform, steel mesh, handle, Allen wrench, brush and other accessories. Constructed with a metal plating structure, it is lightweight, durable and offers precision bearing capacity. Compatible with high-precision BGA universal stencils that can be heated directly. The reballing station itself can be heated directly using a hot air welding station and should be used with 90x90mm BGA reballing stencils.